High Temperature Socket
A major chip company contacted the owner of signal probe with a request for a socket that could test chips at 300 C. This poses three major design challenges.
1. Most socket materials have melting temperatures below the proposed test temperature.
2. Typical contactors are composed of alloys that anneal and lose functionality at high temperatures
3. The test PCB board would not withstand high temperatures, as other components would likely melt.
As a result, we had to employ the following solutions:
1. Use Ceremic Filled PEEK, a material generally used for bathroom tiling, due to its high melting point.
2. Redesign contactors that would use tungsten metal, capable of withstanding extraordinarily high temperatures
3. Design a series of intake and exhaust geometries to localize the heating of the chip and prevent damage to the extent of the board.
After several design revisions, we implemented these solutions into a single product. This socket used aspen aerogel in an aluminum housing to restrict hot air intake to the chip, while providing exhaust outlets to the sides and rear. In addition, we designed a cold air intake and exhaust to further relieve thermal stress on the board and neutralize heat influx.
1. Most socket materials have melting temperatures below the proposed test temperature.
2. Typical contactors are composed of alloys that anneal and lose functionality at high temperatures
3. The test PCB board would not withstand high temperatures, as other components would likely melt.
As a result, we had to employ the following solutions:
1. Use Ceremic Filled PEEK, a material generally used for bathroom tiling, due to its high melting point.
2. Redesign contactors that would use tungsten metal, capable of withstanding extraordinarily high temperatures
3. Design a series of intake and exhaust geometries to localize the heating of the chip and prevent damage to the extent of the board.
After several design revisions, we implemented these solutions into a single product. This socket used aspen aerogel in an aluminum housing to restrict hot air intake to the chip, while providing exhaust outlets to the sides and rear. In addition, we designed a cold air intake and exhaust to further relieve thermal stress on the board and neutralize heat influx.
